Vacuum thin film deposition deposits metallic or non-metallic materials in vapor phase onto substrate surfaces under vacuum conditions to form dense uniform thin films. Thin film quality is critical to realizing full functionality of semiconductor devices.
Process Introduction
Vacuum thin film deposition deposits metallic or non-metallic materials in vapor phase onto substrate surfaces under vacuum conditions to form dense uniform thin films. Thin film quality is critical to realizing full functionality of semiconductor devices.
Technical Applications
Thin film deposition is mainly used in micro-nano semiconductor manufacturing. Metals and ITO are primarily deposited for electrode fabrication; other non-metallic materials form dielectric insulation layers and sacrificial mask layers.
Deposition Materials
Metals: Ti, Al, Ni, Au, Ag, Cr, Pt, Cu, TiW90, Pd, Zn, Mo, W, Ta, Nb, etc.
Non-metals: Si, SiO2, SiNx, Al2O3, HfO2, MgF2, ITO, Ta2O5, etc.
Process Capacity
Compatible substrates: Silicon wafer, quartz glass, sapphire, PET, PI, etc.
