Polyimide (PI) is synthesized via polycondensation of PMDA (Pyromellitic Dianhydride) and DDE (4,4'-Oxydianiline) in polar solvents, followed by film casting and imidization. PI features outstanding high/low temperature resistance, electrical insulation, adhesion, chemical resistance, mechanical strength and radiation resistance. It can operate stably at -269°C to 280°C long-term, and withstand short-term peak temperatures up to 400°C. Meiming Electronics masters processing technologies for both PI dry film and PI liquid photoresist to provide premium technical support for clients.
Process Introduction
Polyimide (PI) is synthesized via polycondensation of PMDA (Pyromellitic Dianhydride) and DDE (4,4'-Oxydianiline) in polar solvents, followed by film casting and imidization. PI features outstanding high/low temperature resistance, electrical insulation, adhesion, chemical resistance, mechanical strength and radiation resistance. It can operate stably at -269°C to 280°C long-term, and withstand short-term peak temperatures up to 400°C. Meiming Electronics masters processing technologies for both PI dry film and PI liquid photoresist to provide premium technical support for clients.
Technical Applications
As a special engineering material, polyimide is widely used in aerospace, microelectronics, nanotechnology, liquid crystal displays, separation membranes, laser devices and other fields.
Process Capacity
PI Dry Film: Thickness 20–150um, maximum etching depth ≤15um
Photosensitive PI Solution: Minimum line width 5um, thickness 5–20um
Non-Photosensitive PI Solution: Etching depth range 0–15um
