Sputtering target is a material for thin film deposition via sputtering process, manufactured from metals and ceramics.
By integrating melting, sintering, synthesis and precision machining technologies, we can fabricate targets with various raw materials, purities and customized shapes.
| High Purity Metals | Al, Co, Cu, Fe, Mg, Mn, Sn |
|---|---|
| High Melting Point Metal Alloys | Alloys of Cr, Mo, Nb, Ta, Ti, V, W series |
| Non-Magnetic Alloys | Alloys of Al, Bi, Cu, Mg, Sn, Zn / Bi2Te3, Mg2Si |
| Magnetic Alloys | Alloys of Co, Fe, Ni / Co-Fe-B, Co-Pt, Fe-Pt |
| Heusler Alloys | Co-based, Fe-based, Ni-based Heusler Alloys |
| Mn Series Alloys | Mn-Al, Mn-Bi, Mn-Ga, Mn-Ir, Mn-Si |
| Precious Metal Alloys | Alloys of Au, Ag, Pt, Pd series |
Unit [mm]
| Circular Target | Diameter | φ50.8, φ76.2, φ101.6, φ127, φ152.4, φ203.2, φ254, φ304.8, φ355.6, φ406.4, φ508, φ533.4 |
|---|---|---|
| Rectangular Target | Plane Size | 127×304.8, 127×381, 127×508, 127×558.8, 152.4×508 |
| Thickness | t3, t5, t6.35 | |
