Electron Beam Photoresist - SU-8 GM1010 / HSQ / XR-1541-002/004/006 / HSQ Fox-15/16 / PMMA Series

Suitable for metal patterning in MEMS, packaging, biochip processes to avoid dry etching

Suitable for metal patterning in MEMS, packaging, biochip processes to avoid dry etching

Sputtering target is a material for thin film deposition via sputtering process, manufactured from metals and ceramics.

Sputtering target is a material for thin film deposition via sputtering process, manufactured from metals and ceramics.

Sputtering target is a material for thin film deposition via sputtering process, manufactured from metals and ceramics.

Ir-Mn features non-volatility and unlimited rewrite cycles, applied as antiferromagnetic layer for non-volatile MRAM. We developed melting manufacturing process for low oxygen content targets.

We can supply products with low oxygen deficiency and high crystallinity.

适用于MEMS、封装、生物芯片等工艺金属图形化避免使用干法刻蚀工艺

适用于MEMS、封装、生物芯片等工艺金属图形化避免使用干法刻蚀工艺

进口Microchem SU-8光刻胶系列，克服了普通光刻胶采用UV光刻深宽比不足的问题，在近紫外光（365nm-400nm）范围内光吸收度很低，且整个光刻胶层所获得的曝光量均匀一致，可得到具有垂直侧壁和高深宽比的厚膜图形。

Imported SU-8 photoresist series solves the insufficient aspect ratio issue of standard photoresists under UV lithography. It exhibits very low light absorption in the near-ultraviolet range (360nm-400nm) and delivers uniform exposure across the entire photoresist layer, enabling thick-film patterns with vertical sidewalls and high aspect ratios.